Module with integrated power electronics circuit and logic circuit and method for interconnecting a power electronics circuit with a logic circuit

摘要

A method for interconnecting a power electronics circuit with a logic circuit, the method comprising: providing a first lamination substrate (304) comprising a dielectric material (306) and a metal foil (308); arranging a logic circuit board core (200) and a prelaminated power semiconductor module Inlays (302) on the first lamination substrate (304), wherein the power semiconductor module inlay (302) comprises one or more power semiconductor chips (106) which are completely embedded in a dielectric material (108); arranging a second lamination substrate (312) comprising a dielectric material (314) and a metal foil (316) on the logic circuit board core (200) and the power semiconductor module inlay (302) so that a stack is formed; laminating the stack; attaching one or more logic chips (118) to the Metal foil (316) of the second lamination substrate (312) above the logic circuit board core (2 00); and forming a one-piece elastic connection (104) between the power semiconductor module inlay (302) and the logic circuit board core (200), the one-piece elastic connection (104) mechanically and electrically between the power semiconductor module inlay (302) and the logic circuit boards -Core (200) connects.