首页> 外国专利> INTEGRATED HIGH SIDE GATE DRIVER STRUCTURE AND CIRCUIT FOR DRIVING HIGH SIDE POWER TRANSISTORS

INTEGRATED HIGH SIDE GATE DRIVER STRUCTURE AND CIRCUIT FOR DRIVING HIGH SIDE POWER TRANSISTORS

机译:用于驱动高侧功率晶体管的集成高侧栅极驱动器结构和电路

摘要

The present invention relates to an integrated high side gate driver structure for driving a power transistor. The high side gate driver structure 411 includes a semiconductor substrate comprising a first polarity semiconductor material on which first well diffusions 426 , 430 comprising a second polarity semiconductor material are formed. A peripheral outer wall 430 of the first well diffusion is adjacent the semiconductor substrate. A second well diffusion 427 , 429 comprising a first polarity semiconductor material is formed such that an outer peripheral wall 429 of the second well diffusion is adjacent to an inner peripheral wall 430 of the first well diffusion. arranged inside the diffuser. The integrated high side gate driver structure further includes a gate driver comprising a high side positive supply voltage port, a high side negative supply voltage port, a driver input and a driver output, wherein the gate driver includes a control terminal of the transistor driver and a transistor driver. a transistor driver arranged in the second well diffusion 429 such that an output terminal of the , respectively, is coupled to a driver input and a driver output; The integrated high side gate driver structure also includes a first electrical connection between the first well diffusion and the high side negative supply voltage port and a second electrical connection between the second well diffusion and the high side negative supply voltage port. .
机译:本发明涉及一种集成的高侧栅极驱动器结构,用于驱动的​​功率晶体管。高侧栅极驱动器结构411包括包含在其上形成第一阱扩散426,430包括第二极性的半导体材料的第一极性的半导体材料的半导体衬底。第一阱扩散的周边外壁430邻近半导体衬底。第二阱扩散427,429,其包括第一极性的半导体材料被形成为使得所述第二阱扩散的外周壁429是邻近于所述第一阱扩散的内周壁430。配置在扩散内部。集成的高侧栅极驱动器结构还包括栅极驱动器,其包括一个高侧正电源电压端,一个高侧负电源电压端,驱动器输入端和驱动器输出,其中,所述栅极驱动器包括晶体管驱动器和一个控制端晶体管的驱动程序。布置在所述第二阱扩散的晶体管驱动器429,使得所述输出端分别被耦合到驱动器输入和驱动器输出;集成的高侧栅极驱动器结构还包括第一阱扩散和高侧负电源电压端口和所述第二阱扩散和高侧负电源电压端之间的第二电连接之间的第一电连接。 。

著录项

  • 公开/公告号KR102287060B1

    专利类型

  • 公开/公告日2021-08-09

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR1020167022804

  • 申请日2015-01-16

  • 分类号H01L21/8238;H01L21/761;H03F3/217;

  • 国家 KR

  • 入库时间 2022-08-24 20:28:18

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