CMP pad structures having composite properties using additional fabrication processes

摘要

Problem to be solved: to provide a polishing pad including the composite pad body and a method for forming the polishing pad.Composite pad bodyOne or more first features formed of a first material or a first material mixtureA second material or one or more second features formed of a second material mixtureOne or more first features and one or more second featuresFirst material or first material mixtureAndBy depositing a plurality of layers including a second material or a second material mixtureIt is formed.Fig. 3 (a)