Direct-bonded copper substrates produced by silver sintering

摘要

A direct-bonded copper substrate (DBC substrate) includes a ceramic plate, a first leadframe which is arranged on a first side of the ceramic plate, a second leadframe which is arranged on a second side of the ceramic plate, and a sintered connection between the first leadframe and the ceramic plate. The ceramic plate is at least one of an alumina plate, an aluminum nitride plate, a silicon nitride plate, or a boron nitride plate. A surface of the ceramic plate is metallized, and the first lead frame is arranged on the metallized surface of the ceramic plate. The first leadframe is an electrically conductive metal conductor track, and the second leadframe is an electrically conductive metal conductor track, a solid sheet metal, a metal foil or a conductive foil made of boron nitride, graphite or carbon.