Cross flow conduit to prevent foaming in high convection plating cells

摘要

Embodiments herein relate to apparatuses and methods for electroplating one or more materials on a substrate. Embodiments herein direct the flow of fluid below a level that is lower than the level of the fluid in a fluid containment unit for collecting fluid that overflows from a plating system for recirculation from a region between a substrate and a channeled ion-resistive plate near the substrate. Utilize a cross flow conduit within the electroplating cell to switch. The cross flow conduit may include channels cut into components of the plating cell to allow diverted flow, or an attachable diverter mountable to an existing plating cell to divert flow downward to a fluid containment unit. It may include a device. Embodiments also include a flow restrictor, which may be a pressure relief valve or plate for regulating the flow of fluid in the cross flow conduit during plating.