首页> 外国专利> Copper based powder, surface coated copper based powder, mixed powder of these, laminated laminate, method for producing the same, and various metal parts

Copper based powder, surface coated copper based powder, mixed powder of these, laminated laminate, method for producing the same, and various metal parts

机译:基于铜的粉末,表面涂层铜基粉末,混合粉末,层压层压板,制造方法和各种金属部件

摘要

An object of the present inventionEspecially 1.2 μ When lamination is performed by irradiating a laser beam having a wavelength ofCopper powderIt is possible to form a powder layer with a small porosity and high densitySuitable for forming a layered material consisting of a high-density copper based materialCopper powderSurface coated copper based powder, mixed powder of these, laminated laminate and its manufacturing methodAndVarious metal parts formed using a laminated material are provided.Copper based powder of the present invention 1.2 μ Laser beam with wavelength of less than m is used as a material to be laminated and the average particle size is 50 μ The 50% particle diameter (D50) is 50 to 50 of the cumulative particle size distribution obtained by measuring the volume μ M and 10% particle diameter μ M.
机译:当通过照射具有波长的激光束来进行层压时,本发明的一个目的是通过照射具有波长粉末的激光束来形成具有小孔隙率的粉末层和高密度,以形成由高密度铜基的材料电囊组成的层状材料提供粉末基于铜基的粉末,它们的混合粉末及其使用层压材料形成的层压层压板及其制造方法配备的制造配备金属部件。基于Popper的粉末,本发明的粉末1.2μm激光束,波长小于m,用作材料被层压,平均粒径为50μm粒径(D50)是通过测量体积μM和10%粒径μM而获得的累积粒度分布的50至50个。

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