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System and Method for Wafer-By-Wafer Overlay Feedforward and Lot-To-Lot Feedback Control

机译:晶晶圆覆盖的系统和方法覆盖前馈和批次到批次反馈控制

摘要

An overlay control system is disclosed. In embodiments, the system may include a controller configured to: acquire a set of feedback overlay measurements based on a plan of record (POR) sampling map on a second layer of samples of at least one previous lot of samples; generate a reference wafer overlay map based on the set of feedback overlay measurements; acquire a set of feedforward overlay measurements based on a feedforward sampling map on a first layer of a set of samples of a current lot of samples; generate a set of artificial overlay vector maps for the set of samples of the current lot of samples based on the set of feedforward overlay measurements; and cause a lithography tool to fabricate a second layer of samples of the current lot of samples based on the reference wafer overlay map and the set of artificial overlay vector maps.
机译:公开了一种覆盖控制系统。在实施例中,该系统可以包括控制器,该控制器被配置为:基于在至少一个先前批次的样本的第二层样本上的记录(POR)采样图中获取一组反馈覆盖测量。基于反馈覆盖测量集生成参考晶片覆盖图;基于电流大量样品的一组样本的第一层上的前馈采样映射获取一组馈电覆盖测量;基于馈电覆盖测量的一组,生成一组人工覆盖矢量地图,用于当前批次样品的电流批次样本的样本;并使光刻工具基于参考晶片覆盖图和一组人工覆盖矢量图制造当前批次样本的第二层样品的第二层。

著录项

  • 公开/公告号US2021216021A1

    专利类型

  • 公开/公告日2021-07-15

    原文格式PDF

  • 申请/专利权人 KLA CORPORATION;

    申请/专利号US202016742209

  • 申请日2020-01-14

  • 分类号G03F7/20;

  • 国家 US

  • 入库时间 2022-08-24 19:56:52

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