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Organic-inorganic composite particles and manufacturing method therefor, and thermally conductive filler and thermally conductive resin composition and manufacturing method therefor

机译:有机 - 无机复合颗粒及其制造方法,与导热填料和导热树脂组合物及其制造方法

摘要

Organic-inorganic composite particles include: a vinyl polymer that is a polymer of a polymerizable vinyl monomer; and inorganic particles including inorganic oxide and/or inorganic nitride. The thermal conductivity of the inorganic particles is 10 W/(m·K) or more. The inorganic particles are subjected to a surface treatment by acidic phosphoric acid ester having no polymerizable functional group, and by at least one polymerizable compound selected from the group consisting of: carboxylic acid having a polymerizable functional group; acidic phosphoric acid ester having a polymerizable functional group; and lactone having a polymerizable functional group. The polymerizable compound is bonded to the vinyl polymer, and the inorganic particles are unevenly located on surface layers of the organic-inorganic composite particles so that the inorganic particles form one or more layers.
机译:有机 - 无机复合颗粒包括:作为可聚合乙烯基单体的聚合物的乙烯基聚合物;和包括无机氧化物和/或无机氮化物的无机颗粒。无机颗粒的导热率为10w /(m·k)以上。无机颗粒通过不具有可聚合官能团的酸性磷酸酯进行表面处理,并通过至少一种选自可聚合官能团的羧酸的至少一种可聚合化合物;具有可聚合官能团的酸性磷酸酯;和内酯具有可聚合官能团。可聚合化合物与乙烯基聚合物键合,无机颗粒位于有机 - 无机复合颗粒的表面层上,使得无机颗粒形成一个或多个层。

著录项

  • 公开/公告号US11060007B2

    专利类型

  • 公开/公告日2021-07-13

    原文格式PDF

  • 申请/专利权人 SEKISUI KASEI CO. LTD.;

    申请/专利号US201816491335

  • 发明设计人 KENGO NISHIUMI;

    申请日2018-03-30

  • 分类号C08K9/04;C09K5/14;C08K3/22;

  • 国家 US

  • 入库时间 2022-08-24 19:54:44

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