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WAFER CLAMP HARD BURL PRODUCTION AND REFURBISHMENT
WAFER CLAMP HARD BURL PRODUCTION AND REFURBISHMENT
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机译:晶圆夹硬Burl生产和翻新
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摘要
Systems, apparatuses, and methods are provided for manufacturing a wafer clamp having hard burls. The method can include providing a first layer that includes a first surface. The method can further include forming a plurality of burls over the first surface of the first layer. The forming of the plurality of burls can include forming a subset of the plurality of burls to a hardness of greater than about 6.0 gigapascals (GPa).
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