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THERMOELECTRIC COOLER, MANUFACTURING METHOD FOR THERMOELECTRIC COOLER, AND ELECTRONIC DEVICE

机译:热电冷却器,热电冷却器的制造方法和电子装置

摘要

A thermoelectric cooler, a manufacturing method for the thermoelectric cooler, and an electronic device. The thermoelectric cooler comprises two single-crystal silicon substrates (1) opposite to each other, and multiple semiconductor thermoelectric particles (3) located between the two single-crystal silicon substrates (1); the sides of the single-crystal silicon substrates (1) towards the semiconductor thermoelectric particles (3) are each provided with an insulating layer (4); conductive sheets (2) are provided between the insulating layers (4) and the semiconductor thermoelectric particles (3); the conductive sheets (2) are electrically connected to the semiconductor thermoelectric particles (3) so that the semiconductor thermoelectric particles (3) form a series connection circuit. Because the semiconductor thermoelectric particles (3) have a thermoelectric effect, the two single-crystal silicon substrates (1) of the thermoelectric cooler can be used for cooling and heating respectively. The single-crystal silicon substrates (1) are used as substrates of the thermoelectric cooler, the single-crystal silicon substrates (1) are low in cost, and thus, the thermoelectric cooler is low in cost.
机译:热电冷却器,热电冷却器的制造方法和电子设备。热电冷却器包括彼此相对的两个单晶硅基板(1),以及位于两个单晶硅基板(1)之间的多个半导体热电粒子(3);单晶硅基板(1)朝向半导体热电颗粒(3)的侧面各自设有绝缘层(4);导电片(2)设置在绝缘层(4)和半导体热电颗粒(3)之间;导电片(2)电连接到半导体热电粒子(3),使得半导体热电粒子(3)形成串联连接电路。因为半导体热电颗粒(3)具有热电效应,所以热电冷却器的两个单晶硅基板(1)可分别用于冷却和加热。单晶硅基板(1)用作热电冷却器的基板,单晶硅基板(1)成本低,因此,热电冷却器成本低。

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