COMPOSITION FOR FORMING UNDERLAYER FILM FOR IMPRINTING, METHOD FOR PRODUCING COMPOSITION FOR FORMING UNDERLAYER FILM FOR IMPRINTING, PATTERN PRODUCING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT, CURED PRODUCT, AND KIT

摘要

Provided are a composition for forming an underlayer film for imprinting, including a curable component, and a particulate metal which has a particle diameter of 10 nm or larger, as measured by a single particle ICP-MASS method, and contains at least one kind of iron, copper, titanium, or lead, in which a content of the particulate metal is 50 ppt by mass to 10 ppb by mass with respect to the composition; a method for producing a composition for forming an underlayer film for imprinting; a pattern producing method; a method for manufacturing a semiconductor element; a cured product; and a kit.