Laser ablation devices that utilize beam profiling assemblies to clean and process surfaces

摘要

Laser ablation devices that utilize beam profiling assemblies to clean and process surfaces are described herein. A method includes directing a laser beam in a geometrical pattern at an arcuate surface of a cylindrical target, blocking a portion of the laser beam to prevent a portion of the geometrical pattern from contacting the cylindrical target, and rotating the cylindrical target as the laser beam contacts the arcuate surface so as to ablate the cylindrical target.