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PROCESS FOR MANUFACTURING A RELAXED GAN / INGAN STRUCTURE

机译:制造轻松的GaN / Ingan结构的过程

摘要

Method comprising the following steps: a) providing a device comprising: - a GaN / InGaN structure comprising an electrically conductive layer of doped GaN (204) locally covered by InGaN mesas (100) comprising a layer of doped InGaN (101) ) and an undoped or lightly doped InGaN layer (102), - an electrically insulating layer (300) covering the electrically conductive layer in doped GaN (204) between the mesas (100), b) connecting the electrically conductive layer in GaN doped (204) and a counter electrode (500) to a voltage or current generator, c) immerse the device and the counter electrode (500) in an electrolytic solution, d) apply a voltage or a current between the doped GaN electrically conductive layer (204) and the second electrode (500) for porosifying the doped InGaN layer (101), e) forming an InGaN layer by epitaxy on the InGaN mesas (100), whereby a relaxed epitaxial InGaN layer is obtained. Figure for the abstract: 4
机译:包括以下步骤的方法:a)提供一种装置,该装置包括: - GaN / IngaN结构,其包括由IngaN Mesas(100)局部覆盖的掺杂掺杂GaN(204)的导电层,所述GaN / IngaN结构包括由InGaN Mesas(100)包括一层掺杂的Ingan(101))和一个未掺杂或轻微掺杂的IngaN层(102), - 电绝缘层(300),覆盖在Mesas(100),B)之间的掺杂GaN(204)中的导电层覆盖导电层(204)中的导电层和电压或电流发生器的对电极(500)C)将装置和电解液(500)浸入电解液中,D)施加电压或电流在掺杂GaN导电层(204)之间施加电压或电流通过在IngaN Mesas(100)上通过外延形成掺杂的IngaN层(101),e)的第二电极(500)通过外延形成IngaN层,由此获得松弛的外延IngaN层。 摘要的数字:4

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