首页> 外国专利> PROCESS FOR MANUFACTURING A SUBSTRATE INCLUDING A RELAXED INGAN LAYER

PROCESS FOR MANUFACTURING A SUBSTRATE INCLUDING A RELAXED INGAN LAYER

机译:制造包括弛豫的IngaN层的基板的方法

摘要

Process for manufacturing a substrate comprising the following steps: - providing a stack comprising an initial substrate, a GaN layer, a doped InGaN layer (13) and an unintentionally doped InGaN layer (14), - transfer the layer InGaN doped (13) and the layer of InGaN not intentionally doped (14) on an anodization support (21), so as to form a second stack (20), - immerse the second stack (20) and counter electrode in an electrolytic solution, and apply a voltage or current between the doped InGaN layer (13) and a counter electrode, to porosify the doped InGaN layer (13), and relax the InGaN layer unintentionally doped (14), - transfer the doped InGaN layer (13) and the unintentionally doped InGaN layer (14) on a support of interest, - form an InGaN layer by epitaxy on the d layer Unintentionally doped InGaN, whereby a relaxed epitaxial InGaN layer is obtained. Figure for the abstract: 1B
机译:制造包括以下步骤的基板的方法:提供包括初始基板,GaN层,掺杂的Ingan层(13)和无意掺杂的IngaN层(14)的堆叠, - 转移掺杂(13)的层ImaN(13)在阳极氧化载体(21)上没有故意掺杂(14)的IngaN层,以形成第二堆叠(20), - 将第二堆叠(20)和电极浸入电解液中,并施加电压或掺杂的IngaN层(13)和对电极之间的电流,用于挖出掺杂的IngaN层(13),并在无意地掺杂(14)中弛豫IngaN层, - 转移掺杂的Ingan层(13)和无意掺杂的Ingan层(14)对感兴趣的支持, - 通过在无意掺杂的IngaN上的D层上外延形成IngaN层,从而获得弛豫的外延IngaN层。 摘要的图:1B

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号