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METHOD FOR MANUFACTURING A SUBSTRATE COMPRISING A RELAXED INGAN LAYER

机译:制造包含松弛ingaN层的衬底的方法

摘要

A method for manufacturing a substrate comprising the following steps of: providing a stack comprising an initial substrate, a GaN layer, a doped InGaN layer and an unintentionally doped InGaN layer, transferring the doped InGaN layer and the unintentionally doped InGaN layer to an anodising support, so as to form a second stack, dipping the second stack and the counter-electrode into an electrolyte solution, and applying a voltage or current between the doped InGaN layer and a counter electrode, to porosify the doped InGaN layer, and relaxing the unintentionally doped InGaN layer, transferring the doped InGaN layer and the unintentionally doped InGaN layer to a support of interest, forming an InGaN layer by epitaxy on the unintentionally doped InGaN layer, whereby a relaxed epitaxially grown InGaN layer is obtained.
机译:一种制造基板的方法,包括以下步骤:提供包括初始基板,GaN层,掺杂的Ingan层和无意掺杂的IngaN层的堆叠,将掺杂的IngaN层和无意掺杂的IngaN层转移到阳性辅助支撑件,以便形成第二叠层,将第二堆叠和反电极浸入电解质溶液中,并在掺杂的IngaN层和对电极之间施加电压或电流,以弥接掺杂的IngaN层,并无意中松弛掺杂的IngaN层,将掺杂的IngaN层和无意掺杂的InGaN层转移到感兴趣的载体,通过外延形成InGaN层,在无意掺杂的IngaN层上,由此获得松弛的外延生长的InGaN层。

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