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Techniques for monolithic co-integration of thin-film bulk acoustic resonator devices and III-N semiconductor transistor devices
Techniques for monolithic co-integration of thin-film bulk acoustic resonator devices and III-N semiconductor transistor devices
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机译:薄膜体声谐振器装置和III-N半导体晶体管器件的单片共同整合技术
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摘要
Techniques are disclosed for co-integrating thin-film bulk acoustic resonator (TFBAR, also called FBAR) devices and III-N semiconductor transistor devices. In accordance with some embodiments, a given TFBAR device may include a superlattice structure comprising alternating layers of an epitaxial piezoelectric material, such as aluminum nitride (AlN), and any one, or combination, of other III-N semiconductor materials. For instance, aluminum indium nitride (AlxIn1-xN), aluminum gallium nitride (AlxGa1-xN), or aluminum indium gallium nitride (AlxInyGa1-x-yN) may be interleaved with the AlN, and the particular compositional ratios thereof may be adjusted to customize resonator performance. In accordance with some embodiments, the superlattice layers may be formed via an epitaxial deposition process, allowing for precise control over film thicknesses, in some cases in the range of a few nanometers. In accordance with some embodiments, one or more such TFBAR devices may be formed alongside III-N semiconductor transistor device(s), over a commonly shared semiconductor substrate.
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机译:公开了用于共同整合薄膜堆积声谐振器(TFBAR,也称为FBAR)设备和III-N半导体晶体管器件的技术。根据一些实施例,给定的TFBar装置可包括超晶格结构,其包括外延压电材料的交替层,例如氮化铝(ALN)和其他III-N半导体材料的任何一种或组合。例如,氮化铝铟铟(Al x sub>在 1-x sub> n)中,氮化铝镓(Al x sub> ga 1-x sub> n),或氮化铝铟镓(Al x sub>在 y sub> ga> 1-xy sub> n)中可以与ALN交织并且可以调节其特定的组合物比以定制谐振器性能。根据一些实施例,可以通过外延沉积工艺形成超晶格层,允许精确控制膜厚度,在一些纳米的范围内。根据一些实施例,一个或多个这样的TFBar器件可以在共同共享的半导体衬底上沿III-N半导体晶体管装置形成。
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