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BONDING INTERFACE EVALUATION METHOD AND BONDING INTERFACE EVALUATION DEVICE

机译:键合界面评估方法和粘接界面评估装置

摘要

An ultrasonic transverse wave is transmitted or ultrasonic longitudinal wave and transverse wave are transmitted in a perpendicular direction to a bonding interface between materials by transmission such as a probe. A reflection signal of the transmitted transverse wave reflected by the bonding interface and/or a transmission signal of the transmitted transverse wave transmitted through the bonding interface and the longitudinal wave, a reflection signal of the transmitted longitudinal wave reflected by the bonding interface and/or a transmission signal of the transmitted longitudinal wave transmitted through the bonding interface are received by reception such as the probe. A physical quantity of the reflection signal or the transmission signal of the transverse wave, out of the received signals, and the longitudinal wave, a joined state of the bonding interface is evaluated by analysis evaluation, utilizing a predetermined physical quantity of the reflection signal or the transmission signal of the longitudinal wave.
机译:传输超声波横波或超声波纵向波和横波通过诸如探针的变速器垂直于材料之间的粘合界面传递到垂直方向上。由键合界面反射的透射横波的反射信号和通过接合界面传输的透射横波和纵向波的传输信号,由键合接口和/或由纵向反射的透射纵向波的反射信号和/或通过诸如探针的接收接收通过键合接口发送的透射纵向波的传输信号。通过分析评估评估反射信号的反射信号或横波的传输信号,从接收的信号和纵向波的连接状态,利用预定物理量的反射信号或纵波的传输信号。

著录项

  • 公开/公告号US2021181153A1

    专利类型

  • 公开/公告日2021-06-17

    原文格式PDF

  • 申请/专利权人 TOHOKU UNIVERSITY;

    申请/专利号US201917270381

  • 发明设计人 TSUYOSHI MIHARA;

    申请日2019-07-29

  • 分类号G01N29/04;G01N29/44;

  • 国家 US

  • 入库时间 2022-08-24 19:23:57

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