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Heterostructure field-effect transistor based on semiconductor gallium nitride compound

机译:基于半导体氮化镓化合物的异质结构场效应晶体管

摘要

The utility model relates to the technology of microelectronics, namely to the technology of obtaining discrete devices and monolithic integrated circuits based on a semiconductor compound of gallium nitride, in particular, to the creation of ohmic and barrier contacts for heterostructure field-effect transistors with high electron mobility. In the transistor, the ohmic contact is made on the basis of a three-layer Ta / Al / Pd metallization. The Ta layer with a thickness of 5-100 nm is located on the surface of the semiconductor wafer, on its surface there is an Al layer with a thickness of 50-1000 nm, on the surface of which there is a Pd layer with a thickness of 5-100 nm. The T-shaped gate is made on the basis of a three-layer composition in which a barrier-forming layer of Ni with a thickness of 10-200 nm is located in series on the surface of a semiconductor wafer, a conductive layer based on Al with a thickness of 10-1000 nm, a protective layer based on Pd with a thickness of 10-200 nm ... The technical result is an increase in the thermal stability of electrical parameters. 1 ill.
机译:本实用新型涉及微电子技术技术,即基于氮化镓半导体化合物获得离散装置和单片集成电路的技术,特别是在高处创建异质结构场效应晶体管的欧姆和屏障触点的产生电子迁移率。在晶体管中,欧姆接触基于三层TA / Al / Pd金属化进行。厚度为5-100nm的Ta层位于半导体晶片的表面上,在其表面上存在厚度为50-1000nm的Al层,在表面上有一个PD层厚度为5-100nm。基于三层组合物制成,其中三层组合物,其中厚度为10-200nm的Ni的阻挡层,位于半导体晶片的表面上,导电层基于厚度为10-1000nm的Al,基于PD的保护层,厚度为10-200nm ...技术结果是电参数的热稳定性的增加。 1%。

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