Electronic chip manufacturing processThe specification relates to a method for manufacturing an electronic chip, which comprises the following steps: (a) forming on the top side of a semiconductor substrate (11),A plurality of integrated circuits are formed on the integrated circuits, and grooves separating the integrated circuits are formed on the integrated circuits;(b) On one side of the upper surface of the substrate (11), at least one metal post (19) is deposited on each integrated circuit,Contact with the top surface of integrated circuit,And resin (23),Extending to the groove and the top surface of the integrated circuit;(c) Formed from the top surface of the resin (23),An opening toward the groove having a width greater than or equal to the width of the groove so as to make the side face (191) of at least one pillar (19) of each integrated circuit clear;And (d) cutting to separate the integrated circuit separately.Abstract figure: Figure 10
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