Electronic chip manufacturing process

摘要

Electronic chip manufacturing processThis specification relates to an electronic chip manufacturing process, including the following steps:A metallization connecting adjacent integrated circuit contacts (13) is formed on the first surface side of the semiconductor substrate (11), and a plurality of integrated circuits (13) are formed on the first surface of the semiconductor substrate (11); andA first groove (21) is formed on the first surface side of the substrate (11) to laterally separate the integrated circuits (13), and the metallization connecting the adjacent integrated circuits (13) is cut to form at least a part of the metallization (19 ') on each adjacent circuit (13).Abstract figure: Figure 10