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Base material conveying device and substrate processing apparatus

机译:基材输送装置和基板处理装置

摘要

Problem to be solved: to provide a substrate transporting apparatus capable of removing slack of a long strip like strip and a substrate treating apparatus having this substrate carrying apparatus.The substrate carrier 1 has a first clamp 5, a second clamp 6, and a loosening removal unit 10.The slack removing unit 10 has a plurality of base member pressing members 17, and one of the plurality of base member pressing members 17 applies a pressing force to the base material 2 when the first clamp 5 and the second clamp 6 sandwich the base material 2.This makes it possible to apply tension to the substrate 2 to remove slack.The substrate processing apparatus 30 has a substrate processing unit 25 disposed in the base material processing region 20 of the substrate feed apparatus 1, and it is possible to perform high-precision processing and processing to the substrate 2 having slack removed.Diagram
机译:要解决的问题:提供一种基板传送装置,其能够去除具有该基板承载装置的长条状条带的松弛和基板处理装置。基板载体1具有第一夹具5,第二夹具6和松弛的去除单元10.松弛去除单元10具有多个基部构件按压构件17,并且多个基部构件17中的一个适用a当第一夹具5和第二夹具6夹在基材2中时,将力压到基材2。这使得可以将张力施加到基板2以移除松弛。基板处理装置30具有设置的基板处理单元25在基板馈送装置1的基材处理区域20中,并且可以对具有松弛移除的基板2执行高精度处理和处理.Diagram

著录项

  • 公开/公告号JP2021088442A

    专利类型

  • 公开/公告日2021-06-10

    原文格式PDF

  • 申请/专利权人 株式会社 ベアック;

    申请/专利号JP20190219637

  • 发明设计人 河東 和彦;羽生 慎一;

    申请日2019-12-04

  • 分类号B65H23/038;B26D7/06;B21D43;B65H23/34;B65H20/18;B21D43/02;B26F1/38;

  • 国家 JP

  • 入库时间 2022-08-24 19:09:28

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