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Heterogeneous integration for RF, microwave, and MM wave systems on photoactive glass substrates

机译:RF,微波和MM波系统在光活性玻璃基板上的异质集成

摘要

The present invention includes a method for creating a system in a package with integrated concentrator devices and active devices on a single chip/substrate for heterogeneous integrated system-on-chip (HiSoC) in light-limited glass, said method Silver: masking a design layout including one or more electrically passive and active components on or within a photosensitive glass substrate; Activating a photosensitive glass substrate, heating and cooling to make a crystalline material to form a glass-crystalline substrate; Etching the glass-crystalline substrate; And depositing, growing, or selectively etching a seed layer on the surface of the glass-crystalline substrate on the surface of the photorestrictive glass.
机译:本发明包括一种用于在具有集成集中器装置的封装中创建系统的方法,以及在单个芯片/基板上的用于非均匀集成系统的片上(HIRSoC)的有源器件,所述方法银:掩盖设计在光敏玻璃基板上或内包括一个或多个电气无源和活性组分的布局;激活光敏玻璃基板,加热和冷却,使晶体材料形成玻璃结晶基材;蚀刻玻璃结晶基板;并沉积,生长或选择性地蚀刻在光学玻璃表面上的玻璃结晶基板的表面上的种子层。

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