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Heterogeneous integration for RF, microwave, and MM wave systems on photoactive glass substrates
Heterogeneous integration for RF, microwave, and MM wave systems on photoactive glass substrates
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机译:RF,微波和MM波系统在光活性玻璃基板上的异质集成
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摘要
The present invention includes a method for creating a system in a package with integrated concentrator devices and active devices on a single chip/substrate for heterogeneous integrated system-on-chip (HiSoC) in light-limited glass, said method Silver: masking a design layout including one or more electrically passive and active components on or within a photosensitive glass substrate; Activating a photosensitive glass substrate, heating and cooling to make a crystalline material to form a glass-crystalline substrate; Etching the glass-crystalline substrate; And depositing, growing, or selectively etching a seed layer on the surface of the glass-crystalline substrate on the surface of the photorestrictive glass.
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