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REACTIVE SPUTTER DEPOSITION OF DIELECTRIC FILMS
REACTIVE SPUTTER DEPOSITION OF DIELECTRIC FILMS
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机译:电介质膜的反应溅射沉积
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摘要
Reactive sputter deposition method and system are disclosed, in which a catalyst gas, such as water vapor, is used to increase the overall deposition rate substantially without compromising formation of a dielectric compound layer and its optical transmission. Addition to the sputtering or reactive gas of the catalyst gas can result in an increase of a deposition rate of the dielectric oxide film substantially without increasing an optical absorption of the film.
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