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Substrate support with real time force and film stress control
Substrate support with real time force and film stress control
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机译:具有实时力和薄膜应力控制的基板支撑
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摘要
Embodiments disclosed herein include a substrate support having a sensor assembly and a processing chamber having a sensor assembly. In one embodiment, the substrate support has a pack. The pack has a workpiece support surface and gas holes exiting the workpiece support surface. A sensor assembly is disposed within the gas hole and configured to detect a metric indicative of deflection of the workpiece disposed on the workpiece support surface, the sensor assembly being positioned within the gas hole when A gas is configured to flow past the sensor assembly.
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