首页> 外国专利> ADHESIVE COMPOSITION FOR FLEXIBLE PRINTED WIRING BOARD, ADHESIVE FOR FLEXIBLE PRINTED WIRING BOARD, AND FLEXIBLE PRINTED WIRING BOARD

ADHESIVE COMPOSITION FOR FLEXIBLE PRINTED WIRING BOARD, ADHESIVE FOR FLEXIBLE PRINTED WIRING BOARD, AND FLEXIBLE PRINTED WIRING BOARD

机译:柔性印刷配线板的粘合剂组合物,柔性印刷配线板粘合剂,以及柔性印刷线板

摘要

As an adhesive composition which exhibits excellent long term durability in moist heat environments and excellent adhesive properties, the present invention provides an adhesive composition for a flexible printed wiring board, which contains a polyester-based resin (A1) containing structural units derived from a polycarboxylic acid and structural units derived from a polyhydric alcohol, and which is characterized in that the polyester-based resin (A1) satisfies the requirements. [1] The ester bond concentration is 7 mmol/g or less. [2] The acid value is 3 mg KOH/g or more. [3] The glass transition temperature (Tg) is -5ºC or higher.
机译:作为在潮湿的热环境中表现出优异的长期耐久性的粘合剂组合物和优异的粘合性能,本发明提供一种用于柔性印刷线路板的粘合剂组合物,其含有含有衍生自多羧酸的结构单元的基于聚酯基树脂(A1)衍生自多元醇的酸和结构单元,其特征在于聚酯基树脂(A1)满足要求。 [1]酯键浓度为7mmol / g或更低。 [2]酸值是3mg KOH / g以上。 [3]玻璃化转变温度(Tg)为-5℃或更高。

著录项

  • 公开/公告号WO2021079670A1

    专利类型

  • 公开/公告日2021-04-29

    原文格式PDF

  • 申请/专利权人 MITSUBISHI CHEMICAL CORPORATION;

    申请/专利号WO2020JP35562

  • 发明设计人 NAKANE TAKAYUKI;

    申请日2020-09-18

  • 分类号C09J163;C09J167;C09J167/02;H05K1/03;

  • 国家 JP

  • 入库时间 2022-08-24 18:29:29

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