METHODS APPARATUS FOR OBTAINING DIAGNOSTIC INFORMATION RELATING TO A LITHOGRAPHIC MANUFACTURING PROCESS, LITHOGRAPHIC PROCESSING SYSTEM INCLUDING DIAGNOSTIC APPARATUS

摘要

The diagnostic device monitors the lithographic manufacturing system. First measurement data indicative of a local deviation of some properties across the substrate is obtained using a sensor 202 and/or a separate metrology tool 240 in the lithographic apparatus. Other inspection tools 244 and 248 perform wafer backside inspection and/or reticle backside inspection to generate second measurement data 302. The high-resolution back surface defect image is processed and in a form that can be compared with lower resolution information from the first measurement data. Cross-correlation (CORR) is performed to identify which of the observed defects spatially correlate with the deviations represented in the first measurement data. The correlation map 506 is used to identify potentially related clusters of defects within the more detailed original defect map 520. The resulting device can be identified by pattern recognition (PREC) as part of an automated root cause analysis.