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Gallium Nitride-Based LED Fabrication with PVD-Formed Aluminum Nitride Buffer Layer

机译:基于氮化镓的LED制造具有PVD形成的氮化铝缓冲层

摘要

Fabrication of gallium nitride-based light emitting diodes (LEDs) having aluminum nitride buffer layers formed by physical vapor deposition (PVD) is described. For example, a multi-chamber system includes a physical vapor deposition (PVD) chamber with a target made of aluminum. Also included are chambers adapted to deposit undoped or n-type gallium nitride, or both. In another example, a method of manufacturing a light emitting diode (LED) structure includes forming an aluminum nitride layer on a substrate in a physical vapor deposition (PVD) chamber of a multi-chamber system. An undoped or n-type gallium nitride layer is formed on the aluminum nitride layer in the second chamber of the multi-chamber system.
机译:描述了通过物理气相沉积(PVD)形成的氮化镓基发光二极管(LED)的氮化镓基发光二极管(LED)。例如,多腔室系统包括物理气相沉积(PVD)室,其具有由铝制成的目标。还包括用于沉积未掺杂的或n型氮化镓,或两者的腔室。在另一个例子中,制造发光二极管(LED)结构的方法包括在多室系统的物理气相沉积(PVD)室的基板上形成氮化铝层。在多室系统的第二腔室中的氮化铝层上形成未掺杂的或n型氮化镓层。

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