Here, connecting structures and a process for their production are revealed. An exemplary connection structure has the following characteristics: a first contact element in a first dielectric layer; a second dielectric layer over the first dielectric layer; a second contact element above the first contact element; a barrier layer between the second dielectric layer and the second contact element; and a cover between the barrier layer and the second contact element. An interface between the first contact element and the second contact element shows the coating, but not the barrier layer.
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