Flexible circuit boards for all-in-one chip-on-film, chip packages including them, and electronic devices including them.

摘要

A flexible circuit board for an all-in-one chip-on-film according to an embodiment includes a substrate; a conductive pattern portion disposed on the substrate; and a protective layer partially disposed on the conductive pattern portion, and the conductive layer. The pattern unit includes a first conductive pattern unit and a second conductive pattern unit that are spaced apart from each other, and the first conductive pattern unit and the second conductive pattern unit are sequentially arranged on the substrate. The wiring pattern layer, the first plating layer, and the second plating layer are disposed, the first conductive pattern portion includes a first open region in which the protective layer is opened, and the second conductive pattern portion includes A content of tin of the second plating layer in the first open area is equal to a content of tin of the second plating layer in the second open area. More than the amount may be included. [Selection diagram] Fig. 2a