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EMI shield transfer film removal method and EMI shield transfer film removal device using the same
EMI shield transfer film removal method and EMI shield transfer film removal device using the same
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机译:EMI屏蔽转移膜移除方法和EMI屏蔽转移膜移除装置使用相同
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摘要
The present invention provides a method for removing an EMI shield transfer film for separating an EMI shield transfer film attached to an upper portion of the EMI shield from a substrate, the method comprising: providing a substrate to which the EMI shield transfer film is attached; A partial peeling step of the EMI shield transfer film in which dry ice is sprayed on one end of the substrate to which the EMI shield transfer film is attached to peel off a part of the EMI shield transfer film from the substrate; And a complete peeling step of the EMI shield transfer film separating the partially peeled EMI shield transfer film from the upper portion of the substrate, wherein the entire peeling step of the EMI shield transfer film includes an air spray nozzle for spraying high-pressure air. EMI shield transfer film removal method and EMI shield transfer film including the step of moving to one end of the peeled substrate and spraying high-pressure air to one end of the substrate from which the EMI shield transfer film is partially peeled through an air spray nozzle Provides a removal device. Therefore, while transferring the substrate with the EMI shield transfer film attached, dry ice is sprayed on the top of the substrate to partially peel off the EMI shield transfer film from the top of the substrate. By spraying air, the EMI shield transfer film can be easily separated from the substrate without damaging the substrate.
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