EMI SHIELD FILM REMOVAL METHOD AND REMOVAL DEVICE

摘要

The present invention relates to an EMI shield film removal method and removal device. A stripping part is formed by attaching a separation film on one lower part of an EMI shield in which a film is attached on the top. A guide hole is formed on the corresponding position in which the stripping part is located among substrates in which the EMI shield is attached. The EMI shield is attached to the top of the substrate, and a pin ascends through the guide hole within the substrate. If the pin ascends by blowing air, the stripping part is lifted and a stripping gap is formed between the film and the EMI shield. The present invention more specifically provides the EMI shield film removal method and removal device which easily removes the film from the EMI shield by spreading high pressure air of shock punching property to the stripping gap and prevents the generation of scratch of the substrate caused by a knife during handwork by automatically separating the EMI shield film from the substrate instead of handwork and improve work efficiency and shortens working time. [Reference numerals] (S110) Separation film is attached on one lower surface of an EMI shield in which a film is attached, and a stripping part is formed;(S120) Guide hole is formed on the corresponding position in which a stripping part is located among substrates in which an EMI shield is attached;(S130) EMI shield ia attached to an upper side of a subsstrate;(S140) Pin ascends through a guide hole within a substrate, and a stripping part is lifted by the pin, and a stripping gap s formed between a film and an EMI shield;(S150) Whole film is separated from an EMI shield by spreading air of high pressure to a stripping gap using an air nozzle