EMI semiconductor device with PARTIAL EMI SHIELDING removal using laser ablation

摘要

The semiconductor substrate has a substrate. The first component and the second component are disposed on the substrate. The first component includes an antenna. A lid is disposed on the substrate between the first component and the second component. A conductive layer is formed on the encapsulant in contact with the lead. The first portion of the conductive layer over the first component is removed using laser ablation.