A semiconductor power module (1) and a method for assembling a semiconductor power module are disclosed. The semiconductor power module comprising at least one semiconductor chip (5) sandwiched between a first busbar and a second busbar thereby forming a module substructure. Further, the semiconductor power module includes a first clamping structure arranged to clamp the module substructure along a first axis (101) in order to form a press-pack module (11), and a second clamping structure comprising two heat-sinks and which is arranged to clamp the press-pack module between the two heat-sinks along a second axis (102) being perpendicular to the first axis. Hereby, a robust and reliable power module having low thermal resistance between the heat sinks and the press-pack module is presented. (For publication: Fig. 1)
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