SPRING ELECTRODE FOR PRESS-PACK POWER SEMICONDUCTOR MODULE

摘要

An object of the present invention is to provide a spring electrode for preventing disconnection of a conductive path when a semiconductor chip is short-circuited in a press-pack power semiconductor module. A spring electrode for a press-pack power semiconductor module according to the present invention includes: a first electrode in contact with a power semiconductor chip; a second electrode arranged to face the first electrode; and a pressure pad which connects the first electrode and the second electrode and has flexibility in a normal direction of opposing surfaces of the first electrode and the second electrode, in which the opposing surfaces of the first electrode and the second electrode are polygons of a pentagon or more, and in which sides of the opposing surface of the first electrode and sides of the opposing surface of the second electrode corresponding to these sides are connected in parallel by the pressure pad.