首页> 外国专利> DOUBLE-LAYER CIRCUIT BOARD MADE BY COMBINING SINGLE-LAYER CIRCUIT BOARD ONTO FLAT CABLE AND MANUFACTURING METHOD

DOUBLE-LAYER CIRCUIT BOARD MADE BY COMBINING SINGLE-LAYER CIRCUIT BOARD ONTO FLAT CABLE AND MANUFACTURING METHOD

机译:双层电路板通过将单层电路板组合到扁平电缆和制造方法中制造

摘要

A double-layer circuit board made by combining a single-layer circuit board (1) onto a flat cable and a manufacturing method. Specifically, the single-layer circuit board (1) is manufactured, the single-layer circuit board (1) is a conjoined flexible circuit board comprising a plurality of lamp strip circuit boards, an adhesive is intermittently printed on the back of the circuit board (1) at multiple positions, and multiple holes (1.4, 1.5) are punched out by using dies, wherein some of the holes (1.4, 1.5) are holes that narrow the edge of a single lamp strip or hollow out the middle of a single lamp strip, and some of the holes (1.4, 1.5) are spare holes for conduction of the flat cable; then, the flat cable is manufactured, parallel wires are pasted by using a film with glue to manufacture the flat cable, wire metal is exposed on the flat cable at multiple positions, then the flat cable is cut into multiple gaps (3.2), and the circuit board (1) and the flat cable are aligned and pasted together to form the conjoined flexible circuit board comprising the plurality of lamp strip circuit boards. The circuit board is layered at multiple positions, and the single-layer circuit board (1) on the front is narrowed or hollowed out, facilitating multi-directional turning installation at narrowed or hollowed-out layered positions when the manufactured single LED lamp strip is used.
机译:通过将单层电路板(1)与扁平电缆和制造方法相结合来制造双层电路板。具体地,制造单层电路板(1),单层电路板(1)是包括多个灯条电路板的连体柔性电路板,粘合剂在电路板的背面间歇地印刷(1)在多个位置处,通过使用模具冲压多孔(1.4,1.5),其中一些孔(1.4,1.5)是缩小单个灯条边缘的孔或凹陷中间的孔单灯条,一些孔(1.4,1.5)是用于传导扁平电缆的备件;然后,制造扁平电缆,通过使用带胶水粘贴扁平电缆的薄膜粘贴平行线,在多个位置处暴露在扁平电缆上的金属金属,然后将扁平电缆切割成多个间隙(3.2),电路板(1)和扁平电缆将连接并粘贴在一起以形成包括多个灯带电路板的联合柔性电路板。电路板以多个位置分层,前面的单层电路板(1)变窄或挖空,促进在制造的单个LED灯带时在变窄或挖掘的层状位置处的多向转动装置用过的。

著录项

  • 公开/公告号WO2021057310A1

    专利类型

  • 公开/公告日2021-04-01

    原文格式PDF

  • 申请/专利权人 WANG DINGFENG;

    申请/专利号WO2020CN108998

  • 申请日2020-08-13

  • 分类号H05K1/14;H05K3/46;F21S4;

  • 国家 CN

  • 入库时间 2022-08-24 18:04:02

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