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Interconnect Structures, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices
Interconnect Structures, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices
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机译:互连结构,封装的半导体器件和包装半导体器件的方法
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摘要
Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices are disclosed. In some embodiments, an interconnect structure includes a polymer material and a post passivation interconnect (PPI) pad disposed over the polymer material. A PPI line is disposed within an opening in the polymer material, the PPI line being coupled to the PPI pad.
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