Aluminum plate peeling device and aluminum plate peeling method

摘要

The processing process and equipment configuration can be simplified, and even when the aluminum plate material is thinned or highly flattened, or when the outer diameter of the aluminum plate material is changed, the aluminum plate material can be easily and reliably removed from the stack. Provided are an aluminum plate material peeling device capable of peeling, an aluminum plate material peeling device having an extremely small environmental load, and a high degree of freedom in the implementation environment, and a method for peeling the aluminum plate material. The aluminum plate material peeling device (1) peels one or more aluminum plate materials from a stack of aluminum plate materials (100) in which a plurality of aluminum plate materials (101, 101, ...) Are pressure-annealed and adhered to each other. It is configured to be possible. This peeling device (1) is configured to be able to come into contact with the outer peripheral surface (101a) of the aluminum plate material (101), and can apply vibration V along the stacking direction L of the stacking body (100) to the aluminum plate material (101). It is provided with a vibration transmitting unit (2) configured in the above, and an oscillator (3) that generates vibration V and transmits the vibration V to the vibration transmitting unit (2).