Method for closing an access opening to a cavity and a MEMS component with a closing element

摘要

Method (100) for closing an access opening (230) to a cavity (220), comprising the following steps: providing (120) a layer arrangement (221) with a first layer structure (210) and a cavity arranged adjacent to the first layer structure (210) (220), wherein the first layer structure (210) has an access opening (230) to the cavity (220), performing (140) a CVD layer deposition to form a first cover layer (240) with a layer thickness (D240) on the first layer structure (210) with the access opening (230), the layer thickness (D240) of the first covering layer (240) being selected in relation to a diameter (D230) of the access opening (230) in order to create a taper (240-A) of the first covering layer ( 240) in a central area of the access opening (230), and performing (160) an HDP layer deposition with a first and second substep of forming a second cover layer (250) on the first cover layer (240), with a liner material layer (250) being deposited on the first cover layer (240) in the first substep, with partial sputtering of the liner material layer (250) and also the first cover layer (240) in the second substep ) takes place in the area (230-A) of the access opening (230), and the first and second substeps being carried out alternately and repeatedly.