Procedure for closing an access opening to a cavity and MEMS component with a closure element

摘要

A method (100) for closing an access opening (230) to a cavity (220) comprises the following steps: providing (120) a layer arrangement (221) with a first layer structure (210) and one disposed adjacent to the first layer structure (210) Cavity (220), the first layer structure (210) having an access opening (230) to the cavity (220); Performing (140) a CVD layer deposition to form a first cap layer (240) having a layer thickness (D) on the first layer structure (210) with the access opening (230); and performing (160) an HDP film deposition comprising first and second substeps of forming a second cap layer (250) on the first cap layer (240), wherein in the first substep depositing a liner material layer (250) on the first cap layer (12). 240), wherein in the second substep, a partial re-sputtering of the liner material layer (250) and further the first cover layer (240) in the region (230-A) of the access opening (230) takes place, and wherein the first and second substeps alternately and be repeated several times.