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SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
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机译:半导体封装及其制造方法
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摘要
A semiconductor package may include a substrate; a microelectromechanical device disposed on the substrate; an interconnection structure connecting the substrate to the microelectromechanical device; and a metallic sealing structure surrounding the interconnection structure.
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