Manufacturing method of pre-supplied underfill material, cured product of pre-supplied underfill material, electronic component equipment and electronic component equipment

摘要

To provide a pre-supply type underfill material that suppresses the occurrence of voids in a cured product even when left in a medium temperature range and has excellent moisture and heat resistance of the cured product, the cured product of the pre-supply type underfill material, an electronic component device, and a manufacturing method of the electronic component device.SOLUTION: In an electronic component device 600 including an electronic component 10, a substrate 20, a wiring 15, a connection bump 30, a film-shaped underfill material 40, and a solder resist 60, a pre-supplied type underfill material includes a radical polymerizable compound which is a (meth) acrylate compound, a radical polymerization initiator, an inorganic filler, and a flexible agent, and the radical polymerizable compound is 3 mass% to 30 mass%.SELECTED DRAWING: Figure 2