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Method for evaluating SiC ingot, method of manufacturing SiC device, and evaluation method of SiC seed crystal

机译:评估SiC锭,制造SiC器件方法的方法,以及SiC晶晶的评价方法

摘要

Problem to be solved: to estimate the region in which an interstitial defect exists in SiC ingot.Evaluation method of SiC ingotPreparation steps for preparing two or more SiC substrates from SiC ingots grown from the same seed crystal andIn the first and second wafers of the two or more SiC substrates, respectivelyA first defect and a second defect, which are defects associated with the same penetration defect, are detectedA defect position determining process for specifying the position of said first defect and said second defectBased on the result of the defect locating processA guess process for inferring the location of defects associated with the same Penetration Defect in other SiC substrates andAndThe guess process isThe position of the first defect and the second defectThe branch of the first wafer and the second waferAn offset angle of said SiC ingotOn the other hand, the position of the same Penetration Defect in other wafers is estimated.Diagram
机译:要解决的问题:估计在SiC锭中存在间质缺陷的区域。用于从同一晶晶生长的SiC锭制备两种或更多种SiC衬底的SiC锭剂的评价方法,以及两个或更多个SiC基板的第一和第二晶片,分别是一个缺陷和第二缺陷,其是与之相关的缺陷相同的穿透缺陷是检测到的缺陷位置确定过程,用于指定所述第一缺陷的位置和上述第二缺陷的位置,该缺陷定位处理该过程的猜测过程,用于推断与其他SIC基板中相同的穿透缺陷相关联的缺陷的位置过程是第一缺陷的位置和第二缺陷的第一晶片的分支和第二晶片偏移角的所述SiC Ingoton的另一只手,在其他晶片中相同的穿透缺陷的位置是估计的.diagram

著录项

  • 公开/公告号JP2021038106A

    专利类型

  • 公开/公告日2021-03-11

    原文格式PDF

  • 申请/专利权人 昭和電工株式会社;

    申请/专利号JP20190159585

  • 发明设计人 郭 玲;

    申请日2019-09-02

  • 分类号C30B29/36;C30B25/02;H01L21/66;

  • 国家 JP

  • 入库时间 2022-08-24 17:40:24

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