THROUGH-SILICON VIA (TSV) TEST CIRCUIT, TSV TEST METHOD AND INTEGRATED CIRCUITS (IC) CHIP

摘要

An integrated circuit (IC) with a TSV test circuit, a TSV test method are provided, pertaining to IC technologies. The IC may include a first TSV, a second TSV and a phase detector. A first end of the first TSV may be coupled to a predetermined signal output, and a second end of the first TSV may be coupled to a first end of the second TSV. A second end of the second TSV may be coupled to a first input of the phase detector, and a second input of the phase detector may be coupled to the predetermined signal output. The phase detector may be configured to determine a phase difference between signals at the first and the second inputs. In this IC, a defective TSV can be identified and segregated with a redundant TSV. This IC facilitates efficient fault correction and signal routing in the IC.