Diamond Blade Arranged Regularly On Fan-shaped Equisector and Method thereof

摘要

The diamond blade 1 regularly arranged in the sectoral equidistribution line in the concentric particle arrangement pattern of the present invention is a cutting blade in which fine diamond particles 3 of several tens of microns are used as a cutting edge. It has particle uniformity used to cut various materials for semiconductors and materials such as, and is mounted on the shaft of a rotating machine using a disk 10, so that the top/left/right side processing surfaces (2,2- In 1,2-2), diamond particles (3) are continuously spontaneously grown with a constant exposure interval and degree of exposure to obtain excellent processing quality for the cut surface.