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Bump height measurement device, substrate processing device, bump height measurement method, storage medium

机译:凸起高度测量装置,基板处理装置,凸块高度测量方法,存储介质

摘要

It is in making the measurement of the bump height simple. An optical sensor having a light source and a light receiving element, and irradiating light from the light source on a substrate having a seed layer, a resist layer formed on the seed layer, and a bump formed in an opening of the resist layer, and through the resist layer An optical sensor that detects the reflected light reflected from the seed layer and the reflected light reflected from the bump by the light-receiving element, and based on the reflected light from the seed layer and the reflected light from the bump, the A bump height measuring apparatus comprising a control device for calculating the height of a bump and correcting the height of the bump by subtracting an error due to the refractive index of the resist layer from the height of the bump calculated based on the reflected light.
机译:它正在制造凹凸高度简单的测量。具有光源和光接收元件的光学传感器,以及从具有种子层的基板上的光源照射光,形成在种子层上的抗蚀剂层,以及形成在抗蚀剂层的开口中的凸块。通过抗蚀剂层,光学传感器检测从种子层反射的反射光和光接收元件反射的反射光,并基于来自种子层的反射光和来自凸块的反射光,凸块高度测量装置,包括控制装置,用于计算凸块的高度并通过从基于反射光计算的凸块的高度减去由于抗蚀剂层的折射率而减去误差来校正凸块的高度。

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