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QUANTUM DOT FILM ENCAPSULATION METHOD AND ENCAPSULATED QUANTUM DOT FILM, AND USE THEREOF

机译:量子点膜封装方法和封装量子点膜,及其用途

摘要

The present application discloses a quantum dot film encapsulation method, and an encapsulated quantum dot film. The encapsulation method comprises encapsulating, by means of hot pressing, a barrier film on two sides of a quantum dot film, so as to obtain an encapsulated quantum dot film, the quantum dot film being a composite film containing quantum dots and a polymer. Said method achieves adhesive-free encapsulation, and reduces production costs while improving the light-emitting stability of a quantum dot/polymer composite thin film.
机译:本申请公开了量子点膜封装方法和包封量子点膜。封装方法包括通过热压封装量子点膜的两侧的阻挡膜,以获得包封的量子点膜,量子点膜是含有量子点和聚合物的复合膜。所述方法实现无粘合剂封装,并降低了生产成本,同时提高了量子点/聚合物复合薄膜的发光稳定性。

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