An apparatus comprising: a probe head (140) comprising: a metal housing (142); and a plurality of pins (144) penetrating the metal housing (142); anda circuit board (120) configured to test a semiconductor device, the pins (144) configured to electrically connect the semiconductor device to the circuit board (120), the circuit board (120) comprising: a A ground pad (160, 162) electrically connected between the metal housing (142) and the circuit board (120); the probe head (140) further comprising: a plurality of membranes (180,182) secured in the metal housing (142), wherein the membranes (180, 182) are configured to maintain a predetermined distance (D) of an air gap (142b) surrounding each of the pins (144); wherein the metal housing (142) comprises a multilayer metal and the membranes ( 180, 182) are fixed in the multilayer metal.
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