COPPER OXIDE POWDER FOR USE IN PLATING OF A SUBSTRATE, METHOD OF PLATING A SUBSTRATE USING THE COPPER OXIDE POWDER, AND METHOD OF MANAGING PLATING SOLUTION USING THE COPPER OXIDE POWDER

摘要

The present invention provides a soluble copper oxide powder capable of preventing deterioration of the quality of a copper film formed by plating. The copper oxide powder supplied to the plating liquid for plating of the substrate W contains a plurality of impurities including copper and sodium. The concentration of sodium is less than 20 ppm. Copper oxide powder is regularly supplied to the plating solution. A voltage is applied between the insoluble anode 8 immersed in the plating solution and the substrate W to form a copper film on the substrate W.