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Resin molding and method for producing the same

机译:树脂成型及其制造方法

摘要

To provide a resin molding and a method for producing the same.;A resin molding in which two types of substrates differing in thermal shrinkage are connected together, wherein the thermal shrinkage of a connection part of the two types of substrates is a value between the respective thermal shrinkages of the two types of substrates. It is preferred that the connection part be constituted of an end part of any one substrate of the two substrates. More specifically, there can be adopted an embodiment in which one substrate is a plate-like substrate including reinforcing fibers and a first thermoplastic resin binding the reinforcing fibers to each other and the other substrate is an injection-molded member connected in the plate face direction of the one substrate, wherein the thermal shrinkage of the other substrate is large as compared to the thermal shrinkage of the one substrate. Moreover, the connection part can be formed by adjusting the filling density of reinforcing fibers in an end part of the one substrate to be lower than the filling density of reinforcing fibers in the base part of the one substrate.
机译:提供树脂成型和制造方法。;一种树脂模制,其中在热收缩率下不同的两种基板连接在一起,其中两种类型的基板的连接部分的热收缩是两种类型的基板的各自热收缩差。优选的是,连接部分由两个基板的任何一个基板的端部构成。更具体地,可以采用一个实施例,其中一个基板是板状基板,包括加强纤维和将加强纤​​维彼此结合的第一热塑性树脂,并且另一个基板是连接在板面方向上的注塑构件在一个基板中,其中与一个基板的热收缩相比,另一个基板的热收缩率大。此外,可以通过调节一个基板的端部中的增强纤维的填充密度来形成连接部分,以低于在一个基板的基部的基部的加强纤维的填充密度。

著录项

  • 公开/公告号US10933568B2

    专利类型

  • 公开/公告日2021-03-02

    原文格式PDF

  • 申请/专利权人 TOYOTA BOSHOKU KABUSHIKI KAISHA;

    申请/专利号US201815950873

  • 发明设计人 HIDEO KAMIYA;

    申请日2018-04-11

  • 分类号B29C70/08;B29C45/14;B29L31/30;

  • 国家 US

  • 入库时间 2022-08-24 17:26:42

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