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METHOD FOR PRODUCING RESIN MOLDING DIE, RESIN MOLDING DIE, RESIN MOLDING DIE SET, METHOD FOR PRODUCING MICROCHIP SUBSTRATE, AND METHOD FOR PRODUCING MICROCHIP USING SAID DIE
METHOD FOR PRODUCING RESIN MOLDING DIE, RESIN MOLDING DIE, RESIN MOLDING DIE SET, METHOD FOR PRODUCING MICROCHIP SUBSTRATE, AND METHOD FOR PRODUCING MICROCHIP USING SAID DIE
A method for producing a resin molding die (13) for molding a first substrate (2) having a flow path (2b) and a through-hole (2a), wherein a base die (10) having a concave part (10b) corresponding to the flow path (2b) and a through-hole (10a) corresponding to through-hole (2a) and deeper than the concave part (10b) is prepared, the base die (10) is subjected to electroforming with a first material and is then subjected to electroforming with a second material which is different from the first material, and a protruding part for forming through-hole (10a) by removing the first material that was electrodeposited on through-hole (10a) is formed. The first material has a smaller electroforming stress than the second material, the first material exerts a higher adhesiveness with regard to the base die than the second material, and the second material is harder than the first material.
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